undefined
undefined
+
  • undefined
  • undefined

Water Cooled UV Laser Source Drilling Silicon Wafers

In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.


Consulting products
  • Product Description
  • Parameter
  • Dimensional Drawing
  • Application Field
    • Commodity name: Water Cooled UV Laser Source Drilling Silicon Wafers
    • Commodity ID: 1041772479862628352-7

    In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.

    Water Cooled UV Laser Source drilling silicon wafers

    Powerful Precision: Water-Cooled UV Laser Source Revolutionizes Silicon Wafer Drilling

    In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.

     

    Traditionally, silicon wafer drilling has been a complex and time-consuming process, often plagued by challenges such as thermal damage, debris accumulation, and irregular hole shapes. However, with the introduction of the water-cooled UV laser source, these obstacles have been overcome, facilitating a groundbreaking approach to drilling that guarantees exceptional results, every time.

     

    At the heart of this revolutionary technology lies the water-cooled UV laser source's extraordinary power. Utilizing high-energy ultraviolet light, this laser source delivers a concentrated and controlled beam that allows for precise material removal without compromising the integrity of the silicon wafer. By harnessing the strength of this advanced light source, manufacturers can achieve clean and uniform holes, even in the most intricate patterns, ensuring optimal functionality and performance of the finished product.

     

    The precision afforded by the water-cooled UV laser source is incomparable. Its tightly focused beam enables micron-level drilling accuracy, leaving little room for error. This heightened precision allows manufacturers to create micro-sized holes with utmost control and consistency, crucial for the advancement of microelectronics and other cutting-edge technologies. By employing such exacting techniques, the water-cooled UV laser source empowers manufacturers to push the boundaries of innovation, meeting the ever-increasing demands of the digital era.

     

    Furthermore, the water-cooled feature of this laser source enhances its performance and reliability. By circulating coolant through the system, excessive heat generated during the drilling process is efficiently dissipated. This crucial cooling mechanism mitigates the risk of thermal damage to the silicon wafer, ensuring its structural integrity remains intact. The elimination of thermal stress and associated deformations guarantees a superior-quality product, bolstering the confidence of manufacturers in their ability to deliver excellence in a competitive market.

     

    In addition to its power and precision, the water-cooled UV laser source offers unparalleled versatility. Its adaptable nature enables it to overcome the challenges associated with various silicon wafer types, including different crystal orientations and thicknesses. This flexibility ensures consistent and optimal drilling results, regardless of the specific parameters of the project. Manufacturers can confidently explore diverse applications in fields such as microelectronics, solar energy, and optoelectronics, knowing that the water-cooled UV laser source will adapt seamlessly to their unique requirements.

     

    The implementation of the water-cooled UV laser source in silicon wafer drilling has also ushered in environmental benefits. Traditional drilling methods often involve the use of chemical etchants and other hazardous substances, which pose a risk to both human health and the environment. However, the water-cooled UV laser source dispenses with the need for such chemicals, promoting a safer and ecologically responsible manufacturing process. By prioritizing sustainability without compromising on performance, manufacturers can align their practices with the growing demand for environmentally-conscious solutions.

     

    In conclusion, the integration of the water-cooled UV laser source has revolutionized the art of drilling silicon wafers. Its unprecedented power, precision, reliability, versatility, and sustainability have elevated the industry's capabilities to unprecedented levels. Manufacturers can now achieve flawless results with remarkable efficiency, propelling advancements in microelectronics and other sectors reliant on silicon wafer technology. As the field continues to evolve at a rapid pace, the water-cooled UV laser source remains at the forefront, shaping the future of semiconductor manufacturing with its potent blend of innovation and excellence.

    uv laser

    RFH F9 series Water cooled UV laser's power range is 3w-5w .Comparing with its kinds, F9 series UV laser features with rugged sealed cavity, extremely compact size, simple and robust, high stability, high efficiency, high reliability and excellent laser beam quality.Its compact design suggests no necessity in building big light path, which greatly reduces space and cost and makes it easy to be installed into UV laser marking machines. In addition, F9 series cavity structure has more stability and more excellent scalability, which means the same laser cavity can produce multi-power lasers , and the stability of different power ranges is greatly improved.

    UV LASER

    F9 series uv laser characteristics:   

    1. 355 nm output wavelength, Up to 200 Hz repetition rate; laser power ranging from 3w-5w; Continuous tuning of repetition rate while maintaining constant pulse energy, superior beam pointing and energy stability make the F9 the first choice for micromachining, marking and thin film removal applications 

     

    2. Exceptional beam quality (M²<1.2) ,absolutely assured in all repetition rates; relatively short pulse width <15ns@30 with little heat transfer to surrounding material; perfect beam spot quality(Beam Circularity>90%) 

    Close to Gaussian smooth beam profile with low value M² < 1.2 and good focusability are beneficial for applications such as  

     

    3. Unique Q-switching technology, adapts a variety of control requirements of laser applications;Online refreshment for harmonic coupling technology;Excellent long term power stability Rugged sealed cavity, Extremely compact size, Simple and robust 

     

    4. Digital control technology for the driver,  RS232 control interface ensures easy control and integration with laser marking equipment 

     

    5. This laser adopts one - style design with compact and reasonable structure, easy installation. 

    Easy to transport and saves space due to compact and light design 

     

    Water cooling,cost-effective and reliable end-pumping technology and amplifier-free DPSS design guarantee easy operation and alignment simple installation and low maintenance costs

     

    6. Industrial production process control technology,provides quality stable products.

    F9 uv laser

     

     RFH - The leading industrial solid-state laser manufacturer

     

    For over 16 years with excellent long term stability and exceptional good beam quality

     

    Production in dust-free plant & rigorous quality control system

    From purchasing, pre-production quality check, assembling, finished product testing, warehouse-in inspection, pre-delivery testing to after-sales service, each step is under control to make sure product quality and consistency in both machine parameters and actual running parameters. This is what makes RFH laser lasts longer than its peers. 

    RFH LASER

     

    Top professional team, independent R&D in laser oriented power supply control system

    There is a one-to-one correspondence between power supply and laser. The stability of power supply control system determines if the laser can maximize its performance during operation. RFH Laser has independent R&D in power supply technique which enables timely update and improvement of power supply control system module based on the laser’s need. 16-year experience in R&D and a top professional team make RFH laser a reliable and stable laser system.

    LASER POWER SUPPLY

     

    Core components of oversea brands with guaranteed quality

    Pumping, Q-switching and other core components adopt oversea brands. Work with top brand component suppliers of home and abroad. Each component is guaranteed with its quality from the beginning of materials purchasing. This is why users can trust RFH laser.  

     

    Power supply+laser head+cooling system sold in a group

    Being client-oriented, RFH offers proposal of selling the whole laser system in a group so that the laser system can maximize its performance while maintaining its stability. 

     

    Full-digital display, supporting communication with computer, capable of laser’s remote control

    Each laser developed and produced by RFH can always remain high quality in industrial and extreme conditions of scientific research. With stable beam quality, high efficiency, best cost performance and high reliability, RFH has earned good reputation in different industries at home and abroad. After 16-year development, RFH has become a reputed brand in nanosecond laser industry. 

    uv laser | green laser | Ultraviolet lasers | uv dpss laser | nanosecond laser | UV laser source | Solid State Lasers

    UV LASER

     
    Key words:
    • Water Cooled UV Laser Source
    • Drilling Silicon Wafers
  •  

    Model  S9 UV LASER
      Parameter Index Unit Description
    Laser wavelength 354.7 nm  
    Average Output Power 3.0-5.0 W @30kHz
    Pulse Width <12 ns @30kHz
    Pulse Repetition Rate 10-200 kHz  
    Spatial Mode TEMoo    
    M2 <1.2    
    Beam Diameter 0.8±0.2 mm Measured at window
    Beam Full Divergence Angle <2 mrad  
    Beam Circularity >90 %  
    Pulse-to-Pulse Stability <2 % RMS/@30kHz
    Average Power Stability <5 % RMS/8hr
    Beam-Pointing Drift <30 μrad/℃  
    Polarization Ratio >100:1    
    Polarization Orientation Horizontal    
    Operating Temp. & RH 10 to 35
    <80

    %
     
    Storage Temp. & RH -20 to 65
    <90

    %
     

    Electricity Requirement

    Power Consumption

    100-240
    50/60
    <500
    VAC
    Hz
    W
    Single phase
    Warranty 18
    months