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As the leading industrial solid-state laser manufacturer,RFH laser company offer 355nm ultraviolet (UV) laser,nanosecond 532nm green laser and customized laser ,power range in 3W ,5W ,10W ,15W,18W,35W,for marking plastics,gla
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Shenzhen RFH Laser Technology Co.,Ltd was founded in 2007 with headquarters in Shenzhen High-Tech Industrial Park, branch offices in Wuhan and Suzhou and production base in Huiyang.
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After 16 years of development, RFH now has an industrial laser oriented R&D team made up of top professionals and experts from both home and abroad. Its R&D departments cover engineering, laser and electric.
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铜箔紫外激光切割(超薄金属薄膜激光切割应用)
Release time:2021/09/15
铜箔紫外激光切割(超薄金属薄膜激光切割应用)
使用激光切割铜箔,铜箔也是电子工业中常用的元件之一。该电解质为负电解质,将其沉淀于电路板基底上的一层,并作为电路板的导电体。铜箔是很薄的铜制品。铜和纸一样,厚度也是微米。通常为5um-135um,越薄越宽越难制作。简而言之,将铜压成非常薄的薄片就是铜箔。
紫外激光切割机在铜箔切割应用中得到了广泛的应用。铜箔切割的难点是切边不炭化,没有毛刺,铜箔不变形,实现了卷卷对卷的加工方式。普通的激光切割机热影响大,使用方向不同,精度比紫外激光切割机低。边部炭化时,边沿的热效应就是铜箔翘曲变形。
铜箔激光切割的优势在于激光是冷源,对加工材料热影响小,加工间隙小,加工边光滑,无毛刺,尤其适合铜箔、超薄金属合金等超薄金属材料的切割。另外,它在导电金属薄膜领域也得到了广泛的应用。紫外激光切割机采用镜面扫描,底部真空吸附,冷源减少热源影响,实现铜箔切割完美,也适合超细金属切割
关键词: 铜箔紫外激光切割
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