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Release time：2023-10-18
The glass laser drilling equipment uses a high repetition frequency 532 nm nanosecond green laser, combined with laser back processing (that is, the beam focus moves from bottom to top) process, which can perform various types of thin glass and tubular glass of various materials. Fast finishing. For example, drilling holes along the end face or side wall, cutting special-sized glass sheets, removing the transparent conductive film on the glass substrate, local texturing and scoring of the glass surface, marking on the surface or inside, etc. Depending on the pulse width and pulse repetition frequency, the maximum average laser output power can reach 50 W. As far as glass drilling is concerned, the hole diameter can usually be as small as 0.15 mm and as large as 50 mm or more, which can produce nearly zero-taper through holes, blind holes, oblique holes, step holes, square holes or other special hole shapes. . Tucson Laser uses high repetition frequency nanosecond green fiber laser to process soda-lime glass, borosilicate glass, quartz glass, etc. It has many successful cases in the field of glass deep processing. The applicable glass thickness range is usually 0.1 mm - 10 mm. between. Switching to 0.5 mm thick soda-lime glass, the maximum wire cutting speed can reach more than 22 mm/s. Figures 1 to 3 respectively give some representative pictures of glass processing results.
Release time：2023-10-18
Laser marking machine, as an essential tool for modern enterprises, has been closely related to the information marking of enterprise products. Many large and well-known companies that we are familiar with are using lasers to print their own information. This method is beneficial to improving product quality, long-lasting, and difficult to erase. However, when using a laser marking machine, there may be reasons such as the laser output is not strong or becomes weak.
Release time：2023-10-18
Laser cutting machine is an important tool in the cutting field and is known as the fastest "knife". Its principle is to irradiate the surface of the material with a high-density and high-energy laser beam to melt, vaporize, ablate or reach the ignition point. At the same time, the molten material is blown away by the high-speed airflow coaxial with the beam, thereby cutting the workpiece and forming a cutting.
Release time：2023-09-20
In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.
Release time：2023-09-20
In the world of packaging, the need for clear and durable markings on bottle caps is of utmost importance. As industries strive for enhanced product identification and traceability, the demand for more efficient and precise marking solutions escalates. In this regard, the advent of 5-watt UV laser technology has revolutionized the field, presenting an unparalleled method of cold marking plastic bottle caps with exceptional precision and longevity.
Release time：2023-09-20
Ceramic cups have long captivated our senses, offering a vessel that not only indulges our thirst but also elevates our drinking experience to a realm of elegance and sophistication. With the advent of 355nm nanosecond UV laser engraving technology, this ancient vessel of beverage has been bestowed with a remarkable transformation, transcending its humble origins and becoming an exquisite canvas for artistic expression.
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