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Printed circuit board drilling
In commercial production, there are two laser technologies available for laser drilling. The CO2 laser wavelength is in the far infrared range, and the ultraviolet laser wavelength is in the ultraviolet range.
View DetailsLaser drilling is a highly efficient method of machining holes. When the drilled hole diameter is in the range of 0.125 to 1.2 mm and the hole depth to hole ratio is <16, laser drilling is more economical and efficient than drilling methods such as mechanical, electrical corrosion, electrochemical and electron beam. However, the potential for widespread laser drilling has not been fully exploited. For example, with laser drilling, products with satisfactory geometry, conicity and other technical properties can only be obtained with a drilling aperture of >0.125 mm
View DetailsLaser drilling can be used to produce micro-holes in almost any material. Oxford Lasers offers laser drilling systems and services for micro-hole production and R&D.
View DetailsThe thickness of the mobile phone case is 0.9mm, and the aperture is 0.03mm micro-hole array, slightly heat affected zone.
View DetailsA small hole with a hole diameter of 0.5 mm is cut on a copper piece having a thickness of 0.05 mm, the edge of the small hole is neat, and the heat affected zone is small.
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